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SK海力士推出全球首款TSV技术芯片

发布时间:2020-01-15 01:42:04 阅读: 来源:床头柜厂家

元器件交易网讯 12月26日消息,据外媒报道,SK海力士今天称,它开发了全球首款硅通孔封装(TSV)技术的存储芯片,芯片速度和效率大大提高。

SK海力士称,这款高带宽内存芯片处理速度达到128字节/秒,这是GDDR5芯片的四倍,它可以在1.2伏特的电压下运行。

SK海力士称,这款芯片将耗电量小于40%。

它与AMD共同开发,新产品使用TSV技术结合40纳米级别DRAM,可使DRAM以更高电效率连接。

SK海力士称TSV芯片能够应用于高图形性能设备,也能用于超级计算机和服务器中。据说这款芯片将于2014年下半年开始量产。

(元器件交易网董蕾 译)

外媒原文如下:

SK hynix Inc., the world"s No. 2 chipmaker, said Thursday it has developed the world"s first memory chip equipped with the Through Silicon Via (TSV) technology, significantly improving speed and efficiency.

The South Korean chipmaker said the high-bandwidth memory chip has a 128-gigabytes-per-second processing speed, which is four times faster than the GDDR5 chips, and can run on a relatively small power of 1.2 volts.

The latest product by SK hynix will also consume 40 percent less power, the company added.

Jointly developed with U.S.-based Advanced Micro Devices, the new product combines four 40 nanometer-class dynamic random access memory (DRAM) under the TSV technology, which allows the DRAMs to be connected with higher electrical efficiency.

SK hynix said the TSV-based chip can be applied to devices that require high graphic performance, and it can also be used in super computers and servers. It said the mass production of the cutting-edge chips will begin in the second half of 2014

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